■适用范围 Scope of application
▪柔性线路饭(FPC);
▪覆盖膜(CVL);
▪手机摄像头模组(CCD);
▪指纹模组(BR);
▪HDI板;
▪实装电路板(PCBA );
▪半导体芯片模组等的产品外观成型、开窗、分板工艺制程;
English
▪Flexible circuit board(FPC).
▪Covering membrane(CVL).
▪Mobile camera module(CCD).
▪Fingerprint module(BR).
▪HDI board.
▪Physical circuit board(PCBA).
▪Semiconductor chip modules and other product appearance molding, window opening, split-board process
■特点 Characteristic
▪根据不同场景客制化的紫外激光器,功率稳定衰减小,无需担心功率衰减对切割质量、速度的影响;
▪集成德国SCANLAB高精度数字扫描振镜与高精度直线电机运动平台;
▪专业切割软件可直接导入CAD制作的DXF图形,并精确按照输入图形切割,操作简单。
▪光路部分优化设计后,可以实现同等功率下速度、效果最优化,同时进行高效防尘处理,有效减少设备停机清洁维护周期;
▪设备采用大理石防震平台,整体结构稳重牢固,一体封闭式结构,为高速度,高精度,高良品率;
▪软件兼容各类型功能,简单操作,易学易懂,短时间即可学会基本操作;
▪集成在设备上的真空吸附平台,无需模具或保护板固定,可将待加工基材牢固的固定在位置上,减少了转换产品所花费的时闹;
English
▪Customers choose to configure various types of UV lasers according to the needs, the power stable decay decreases, and there is no need to worry about the influence of power attenuation on the cutting quality and speed.
▪Integration of German SCANLAB high-precision digital scanning vibration mirror and high-precision linear motor motion platform.
▪The professional cutting software can be directly imported into the DXF graphics produced by CAD and cut exactly according to the input graphics.
▪After the optimized design of the optical circuit, the speed and effect of the same power can be optimized. At the same time, the dust protection treatment can be carried out efficiently, effectively reducing the equipment shutdown and cleaning maintenance cycle.
▪The equipment adopts marble shock-proof platform, the overall structure is stable and firm, and the integrated closed structure provides guarantees for high speed, high precision, and high yield production.
▪Software is compatible with all types of functions, simple operation, easy to learn and easy to understand, and can learn basic operations in a short time.
▪Vacuum adsorption platforms integrated into the equipment can be firmly secured to the position of the substrate to be processed without the need for mold or plate fixation, reducing the time taken to convert the product
■机器参数 Parameters
型号(model) |
XJ-8010UV |
平台移动范围(Platform Move Range) |
580*580mm |
最⼤切割范围(Maximum cutting range) |
⻓450 x宽430mm |
平台定位精度(Platform positioning accuracy) |
±8um |
平台重复定位精度(Platform repeated positioning accuracy) |
±4um |
平台移动速度(Platform moving speed) |
2000mm/s |
CCD 定位精度(CCD positioning accuracy) |
±3um @200万像素 |
最⼩切割线宽(Minimum cut line width) |
<10um |
切割尺⼨精度(Cutting dimension precision) |
±20um |
切割锥度(Cutting taper) |
<30um |
激光器输出功率(Laser output power) |
10W |
激光波⻓(Laser wavelength) |
355nm(紫外) |
操作人⼒(Operation manpower) |
1人(上下料) |
单机产能(Single production capacity) |
根据不同产品及要求测试后给定 |
切割厚度(Cutting thickness) |
根据产品的材料及激光器选型 |
设备使⽤功耗(Power consumption of devices) |
220V/10A/50Hz,0.4-0.6Mpa⽓源 |
设备启动功耗(Device startup power consumption) |
220V/15A/50Hz |
设备尺⼨(⻓/宽/高)(Device Size(Length / Width / Height) |
1500mm(显⽰器浮动560MM)x1600mmx1550mm(警⽰灯320mm) |
设备重量(Weight of equipment) |
约 2200kg |
环境要求(Environmental requirements) |
室温 18℃-25℃,湿度<60%,不结露 |