■适用范围 Field of application
▪PCB、FPC、SMT、手机等相关电子行业
▪用于贴合双面胶、导电胶、标签、二维码、压敏胶、泡棉、石墨片、导电网等材料
▪具有高速高精度的特点,极大提升了生产效率
English
▪PCB, FPC, SMT, mobile phone shell and other related electronic industries.
▪Used for binding double-sided adhesive, conductive adhesive, label, two- dimensional code, pressure sensitive adhesive, foam, graphite sheet, guide grid and other materials.
▪High speed and high precision, greatly improve production efficiency.
■特点 Characteristic
▪适用范围广,4吸头Z轴设计,同时贴合70mm宽度物料切向下兼容;
▪高速直线电机驱动,速度可达2m/s,提升60%效率
▪三段式传输轨道,不间断上料设计。
▪机台结构布局紧湊,仅1.54m2占地面积;
▪AI智能系统,CCD飞拍取像,不良自动识别,更精准、更高速;
▪向导式操作系统,高兼容性及智能人机操作界面;
English
▪Wide range of application, 4 suction head Z axis design, while fitting 70mm width material tangential compatibility.
▪High speed linear motor drive, speed up to 2m/s, 60 % efficiency increase.
▪Three-stage transmission track, uninterrupted feeding design.
▪The structure of the platform is compact, with only 1.54 M area.
▪AI intelligent system, CCD flying take image, bad automatic recognition, more accurate, higher speed.
▪Wizard operating system, high compatibility and intelligent man-machine interface.
■机器参数 Parameters
型号(model) |
PL-2000-T4 |
X轴驱动(X axis drive) |
直线电机 |
Y轴驱动(Y axis drive) |
直线电机 --- 单驱 |
Z轴(Z axis) |
伺服电机+同步带,4个Z轴 |
U轴(U-axis) |
4个U轴 |
适⽤材料度(Length of applicable material)(mm) |
3〜60(四头);3〜100(两头) |
适⽤材料宽度(Width of applicable material)(mm) |
2〜30 |
适⽤材料厚度(Applicable material thickness)(mm) |
0.05〜0.50 |
料带卷筒内径(Tape inner diameter) |
3” |
Feeder个数(Feeder number) |
2 〜 4 |
吸嘴个数(Suction number) |
2 〜 4 |
贴装速度(Paste speed) |
0.85-1s |
定位精度(Positioning precision)(mm) |
±0.05 |
贴合重复精度(Matching repeated precision)(mm) |
±0.10 |
可贴合FPC范围(Can fit FPC range)(mm) |
100*100〜350*420 |
贴付⽅式(Method of payment) |
分开吸料,分开贴合 |
传送带⾼度(Belt height)(mm) |
910±30 |
机器尺⼨(Machine size(length, width, height) ( mm) |
1200*1400*1550 |
机器重量(Machine weight)(kg) |
1800 |
机器功率(Machine power)(kw) |
4 |
供电电压(Power supply voltage) |
220VAC |
压缩空⽓(compressed air) |
0.5〜0.8Mpa |
使⽤环境(Use environment) |
温度 21 ± 4℃ 湿度 40 ~70 % |
软件编程⽅式(Software programming methods) |
DXF⼯程资料导⼊ |
贴付⽅式(Method of payment) |
分开(⼀起)吸料,分开贴合 |
视觉相机(Visual camera) |
Mark点扫描、点对点扫描(上相机) |
智能物料偏差校正(下相机) |
|
坏板选择性贴合功能(Bad board selective fitting function) |
上相机识别/底部⼆维码识别 |
上相机直接识别Badmark点 |
|
其他功能(Other Functions) |
真空识别防重贴 |